Device and forming method of device

A forming method of a device comprising a first sealing member, a second sealing member, a first circuit member and a second circuit member, the forming method comprising:

• preparing the first sealing member, the second sealing member, the first circuit member and the second circuit member, the first sealing member basically comprising a first film formed of a film, the first film being provided with an air valve, at least one of the first sealing member and the second sealing member being provided with an uneven portion, the first circuit member comprising a first contact point, the second circuit member comprising a second contact point;
• stacking the first sealing member, the first circuit member, the second circuit member and the second sealing member on each other in this order, the first contact point and the second contact point facing each other, the uneven portion facing at least one of the first circuit member and the second circuit member, the uneven portion covering a predetermined region which corresponds to at least one of the first contact point and the second contact point;
• shutting the first circuit member and the second circuit member in an inner space which is formed in the device, the inner space being enclosed by the first sealing member and the second sealing member and being shut off from an outer space outside the device except for the air valve;
• and
• vacuuming the inner space by using the air valve so that the first contact point and the second contact point are brought into contact with each other.