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US 2022/0192033 A1Published application
Circuit board and method for producing circuit board
AssigneeIdemitsu Kosan Co., Ltd.
InventorsFumioki FUKATSU, Satoshi HACHIYA
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Abstract
A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness RzJIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.
Claims19
A circuit substrate comprising, in the following stacked order,
- a resin base material having a dielectric loss tangent of 0.015 or lower,
- a polyaniline layer comprising a substituted or unsubstituted polyaniline, and
- a metal layer,
- wherein the metal layer has a surface roughness RzJIS of 0.5 μm or less at the surface on the side of the polyaniline layer.
1 more element
Dependencies are inferred from the claim text.