Method for manufacturing printed wiring board

Abstract

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Dependencies are inferred from the claim text.