Electronic component module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakahiro KITAZUME
Life of this patent
Estimating the term…
Abstract
An electronic component module includes a substrate, an inductor element, a mounting type electronic component, a mounting type electronic component, a mounting type electronic component, and a shield film. The substrate has a first main surface and a second main surface, and the second main surface side is a side to be mounted on another circuit board. A mounting type electronic component and a mounting type electronic component are mounted on the first main surface. The shield film covers the mounting type electronic component and the mounting type electronic component and the first main surface side. The inductor element is disposed inside the substrate.
Claims20
An electronic component module comprising:
- a substrate having a first main surface and a second main surface, the second main surface being a mounting side;
- a first electronic component mounted on the first main surface;
- a conductive shield film covering the first electronic component and a side of the first main surface;
- and
- an inductor element disposed inside the substrate, wherein
- the substrate includes a plurality of terminal conductors for connection arranged along an outer peripheral end of the second main surface;
- and
- the inductor element is disposed in a region surrounded by the plurality of terminal conductors when the substrate is viewed in a direction orthogonal to the second main surface;
- and
- the plurality of terminal conductors are outside an outer periphery of the inductor element when the substrate is viewed in a direction orthogonal to the second main surface.
Dependencies are inferred from the claim text.