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US 2022/0192022 A1Published application
Wiring substrate, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorsYuki TAKESHIMA, Yoshihiro HOSOI
Life of this patent
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Abstract
A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.
Claims15
-12. (canceled)
A wiring substrate comprising:
- an insulating substrate having a first surface and a second surface on a side opposite the first surface, and containing AlN;
- a conductor disposed on the first surface and containing Cu;
- and
- an Ni film disposed so as to extend across an upper surface and a side surface of the conductor to the first surface,
- wherein Ti oxide is scattered so as to be at a plurality of points on the first surface.
2 more elements
Dependencies are inferred from the claim text.