Connection structure embedded substrate
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJoo Hwan JUNG, Jae Woong CHOI, Seung Eun LEE, Yong Hoon KIM, Jin Won LEE
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Abstract
A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.
Claims31
A connection structure embedded substrate, comprising:
- a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body;
- a connection structure embedded in the first insulating body and including first and second substrates;
- and
- a connection via disposed between the first and second substrates and penetrating the connection structure,
- wherein the first and second substrates are disposed adjacent to each other.
A connection structure embedded substrate, comprising:
- a printed circuit board including a first insulating layer having a cavity, and a first wiring layer disposed on one surface and the other surface of the first insulating layer;
- a connection structure including first and second substrates disposed in an internal portion of the cavity;
- and
- a connection via penetrating at least a portion of each of the first and second substrates,
- wherein the first and second substrates are disposed adjacent to each other.
A substrate, comprising:
- a printed circuit board;
- first and second substrates embedded in the printed circuit board;
- and
- a connection via disposed between the first and second substrates and connecting the first and second substrates to each other.
A connection structure embedded substrate, comprising:
- a printed circuit board including a plurality of first wiring layers;
- a connection structure embedded in the connection substrate and including a plurality of second wiring layers;
- and
- a connection via extending between two of the plurality of first wiring layers to penetrate through the connection structure, thereby connecting one or more of the plurality of second wirings layers to the two of the plurality of first wiring layers.
Dependencies are inferred from the claim text.