Interposer for active implantable medical device

An interposer comprising:

• a dielectric over-mold structure comprising:
• a weld-pad surface,
• a solder-pad surface opposite the weld-pad surface,
• a perimeter surface around the perimeter of the dielectric over-mold structure and generally orthogonal to the weld-pad surface and the solder-pad surface, and
• a plurality of weld-pad vias associated with the solder-pad surface;
• and
• a plurality of conductive leads integrated with the dielectric over-mold structure, each conductive lead comprising:
• a weld pad having at least one surface exposed through one of the plurality of weld-pad vias,
• a solder pad, and
• a portion connecting the weld pad with the solder pad.

An implantable medical device comprising:

• a feedthrough comprising a support structure and a plurality of electrical contacts extending through the support structure;
• a printed circuit assembly (PCA) comprising a feedthrough portion arranged generally parallel relative to the support structure, the feedthrough portion comprising a plurality of electrical contacts;
• and
• an interposer arranged generally parallel relative to the support structure of the feedthrough and the feedthrough portion of the PCA, the interposer comprising a plurality of leads corresponding in number to the plurality of electrical contacts of the feedthrough, each lead being fixedly secured relative to an over-mold structure, and comprising a weld pad electrically coupled to an electrical contact of the feedthrough, and a solder pad electrically coupled to an electrical contact of the PCA.

An implantable medical device comprising:

• a printed circuit assembly (PCA) comprising a printed circuit board (PCB);
• one or more single pin connectors associated with the PCB, each of the one or more single pin connectors electrically coupled to a component of the implantable medical device;
• and
• one or more single pin interposers comprising a weld pad electrically coupled to one of the one or more single pin connectors, and at least one leg electrically coupled between the weld pad and the PCB, wherein the at least one leg is arranged to offset the weld pad from the PCB.