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US 2022/0192015 A1Published application
Wiring board, electronic device package, and electronic device
AssigneeKYOCERA Corporation
InventorMakoto YAMAMOTO
Life of this patent
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Abstract
Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.
Claims12
A wiring board, comprising:
- an insulating substrate containing aluminum oxide;
- and
- a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate,
- wherein at least one of the insulating substrate and the metallized layer further contains mullite, and
- wherein in the metallized layer,
- the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.
3 more elements
Dependencies are inferred from the claim text.