Back to results
US 2022/0192013 A1Published application
Wiring board, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorsSeiichirou ITOU, Reika NISHIUCHI
Life of this patent
Estimating the term…
Abstract
Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.
Claims18
A wiring board, comprising:
- a base body having insulating properties;
- and
- a wiring conductor positioned on the base body, wherein
- the base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface,
- the first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and
- the fourth surface is an installation surface.
3 more elements
Dependencies are inferred from the claim text.