Wiring circuit board and producing method thereof
AssigneeNitto Denko Corporation
InventorsRyosuke SASAOKA, Yasunari OYABU, Hiroaki MACHITANI, Hayato TAKAKURA
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AssigneeNitto Denko Corporation
InventorsRyosuke SASAOKA, Yasunari OYABU, Hiroaki MACHITANI, Hayato TAKAKURA
Estimating the term…
A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.
A wiring circuit board comprising:
Dependencies are inferred from the claim text.