Radio frequency filtering of printed wiring board direct current distribution layer
AssigneeRaytheon Company
InventorsJohn W. Hauff, Orlando F. Perez, John F. Magnani
Life of this patent
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Abstract
A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.
Claims20
A method of fabricating a printed wiring board, the method comprising:
- etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer, the first epoxy-based layer including radio frequency (RF) absorber material;
- and
- arranging a second epoxy-based layer, the second epoxy-based layer including the RF absorber material and including a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.
A printed wiring board (PWB) comprising:
- a layer of traces configured to carry direct current (DC);
- a first epoxy-based layer, wherein the layer of traces is on a first surface of the first epoxy-based layer, the first epoxy-based layer including radio frequency (RF) absorber material;
- and
- a second epoxy-based layer, the second epoxy-based layer including the RF absorber material and including a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.
Dependencies are inferred from the claim text.