Highly optimized electronic module design
AssigneeBAE Systems Information and Electronic Systems Integration Inc.
InventorsJason M. Bugeau-Medas, Scott P. Rogers, Eric A. Skogsholm
Life of this patent
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Abstract
An electronic module utilizing a bathtub heatsink and single-cover design to provide improved thermal management and fault isolation while minimizing cost and complexity. The electronic module may also provide for better galvanic corrosion prevention through the utilization of a single finish on the components thereof. Further provided may be an electronic module design utilizing a single set of fasteners, which may further reduce assembly cost and complexity while further providing increase galvanic corrosion prevention.
Claims19
An electronic module comprising:
- a cover;
- a printed board with a first side and a second side;
- at least one conductive ground pad on the first side of the printed board between the cover and the printed board;
- at least one active component on the second side of the printed board;
- a heatsink defining a basin for containing the printed board therein having at least one pedestal corresponding to each of the at least one active components;
- at least one gap pad between a top of each of the at least one active component and the at least one corresponding pedestal of the heatsink;
- and
- a plurality of captive fasteners operable to secure the cover, printed board, and heatsink together as a single unit.
A method of thermal management of an electronic module comprising:
- generating heat through the operation of at least one active component of a printed board;
- drawing the heat through a thermal gap pad and away from a top of the at least one active component and into a corresponding pedestal of a heatsink;
- directing the heat from the pedestal into a thermally conductive core layer of the heatsink;
- and
- dissipating the heat out from a rail of an associated system through a rail interface of the heatsink.
Dependencies are inferred from the claim text.