Driver Board Assemblies and Methods of Forming a Driver Board Assembly

A circuit board assembly comprising;

• a printed circuit board (PCB) substrate having a first surface and an opposite second surface, the second surface having a first electrical pattern;
• a cooling assembly thermally coupled to the second surface of the PCB substrate;
• a second substrate sandwiched between the second surface of the PCB substrate and the cooling assembly, the second substrate having an upper substrate surface and an opposite lower substrate surface, the upper substrate surface having a first conductive layer, the first conductive layer having a first thickness, the lower substrate surface having a second conductive layer, the second conductive layer having a second thickness, the second thickness being greater than the first thickness;
• one or more power devices embedded within the PCB substrate between the first surface and the second surface;
• and
• a plurality of conductive layers arranged within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly,
• wherein the first conductive layer of the second substrate has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

A method of forming a circuit board assembly, the method comprising:

• arranging one or more power devices between a first surface and an opposite second surface of a printed circuit board (PCB) substrate;
• arranging a plurality of conductive layers within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices and thermally couple the one or more power devices to a cooling assembly;
• arranging an intermediate layer sandwiched between the second surface of the PCB substrate and the cooling assembly;
• and
• arranging the cooling assembly to couple to the intermediate layer and thermally couple to the second surface of the PCB substrate,
• wherein the intermediate layer has a first electrical pattern that is similarly patterned to a second electrical pattern of the second surface of the PCB substrate.