Camera module and method for manufacturing the same

A method for manufacturing a camera module, comprising:

• providing a holder, a lens, and a plurality of magnets, the holder comprising an inner cavity and an outer wall;
• mounting the lens into the inner cavity, and mounting the plurality of magnets onto the outer wall;
• providing a circuit board assembly, wherein the circuit board assembly comprises an outer wiring substrate, a first inner wiring substrate, and a second inner wiring substrate, the first inner wiring substrate and the second inner wiring substrate are disposed on a same surface of the outer wiring substrate, a first opening is defined between the first inner wiring substrate and the second inner wiring substrate, the first inner wiring substrate comprises a first dielectric layer and two first inner wiring layers on both surfaces of the first dielectric layer, each of the two first inner wiring layer comprises a plurality of coils formed by winding conductive wires of the first inner wiring layer, the second inner wiring substrate comprises two second inner wiring layers, a thickness of each of the plurality of coils is greater than a thickness of each of the two second inner wiring layers;
• and
• bending the circuit board assembly along the first opening, so that the first inner wiring substrate surrounds the outer wall, and each of the plurality of coils corresponds to one of the plurality of magnets.