High-frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakayuki SHINOZAKI
Life of this patent
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Abstract
To achieve miniaturization, a high-frequency module includes a mounting substrate, a power amplifier, and an electronic component. The mounting substrate has a first main surface and a second main surface on opposite sides. The power amplifier is arranged on a mounting substrate. The power amplifier has a driver stage amplifier and an output stage amplifier. The driver stage amplifier is arranged on the second main surface of the mounting substrate. The output stage amplifier is arranged on the first main surface of the mounting substrate. The electronic component is arranged on the first main surface of the mounting substrate. The electronic component overlaps the driver stage amplifier in a plan view from a thickness direction of the mounting substrate.
Claims20
A high-frequency module comprising:
- a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
- a power amplifier arranged on the mounting substrate;
- and
- an electronic component arranged on the mounting substrate, wherein
- the power amplifier includes
- a driver stage amplifier and an output stage amplifier,
- the driver stage amplifier is arranged on the second main surface of the mounting substrate, and
- the output stage amplifier is arranged on the first main surface of the mounting substrate, and
- from a plan view from a thickness direction of the mounting substrate, the electronic component is arranged on the first main surface of the mounting substrate, and at least partially overlaps the driver stage amplifier.
A communication device comprising:
- a signal processing circuit;
- and
- a high-frequency module that includes
- a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate,
- a power amplifier arranged on the mounting substrate, and
- an electronic component arranged on the mounting substrate, wherein the power amplifier includes
- a driver stage amplifier and an output stage amplifier,
- the driver stage amplifier is arranged on the second main surface of the mounting substrate,
- the output stage amplifier is arranged on the first main surface of the mounting substrate,
- from a plan view from a thickness direction of the mounting substrate, the electronic component is arranged on the first main surface of the mounting substrate, and at least partially overlaps the driver stage amplifier, and
- the power amplifier of the high-frequency module amplifies and outputs a transmission signal provided from the signal processing circuit.
Dependencies are inferred from the claim text.