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US 2022/0190806 A1Published application
Multi-filter die
AssigneeIntel Corporation
InventorsGeorgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan
Life of this patent
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Abstract
Embodiments may relate to a die such as an acoustic wave resonator (AWR) die. The die may include a first filter and a second filter in the die body. The die may further include an electromagnetic interference (EMI) structure that surrounds at least one of the filters. Other embodiments may be described or claimed.
Claims20
An acoustic wave resonator (AWR) die comprising:
- a die body comprising a first layer and a second layer neighboring the first layer;
- and
- a filter in the die body,
- wherein the filter comprises a piezoelectric layer positioned at an interface of the first layer and the second layer, a portion of the piezoelectric layer is in the first layer, and another portion of the piezoelectric layer is in the second layer.
1 more element
An acoustic wave resonator (AWR) die, comprising:
- a die body comprising a first layer and a second layer neighboring the first layer;
- a filter in the die body, wherein the filter comprises a piezoelectric layer positioned at an interface of the first layer and the second layer, a portion of the piezoelectric layer is in the first layer, and another portion of the piezoelectric layer is in the second layer;
- and
- an electromagnetic interference (EMI) structure that surrounds at least a portion of the filter.
1 more element
A microelectronic package comprising:
- a package substrate with a first side and a second side opposite the first side;
- an acoustic wave resonator (AWR) die coupled with the first side of the package substrate, the AWR die comprising:
- a first layer,
- a second layer, and
- a filter comprising a piezoelectric layer positioned at an interface of the first layer and the second layer, a portion of the piezoelectric layer is in the first layer, and another portion of the piezoelectric layer is in the second layer;
- and
- an active die coupled with the second side of the package substrate.
4 more elements
Dependencies are inferred from the claim text.