Interposer

A test system comprising:

• a device interface board (DIB) to connect to devices under test (DUTs);
• and
• a test head comprising a blind-mate connection to the DIB, the blind-mate connection comprising an interposer assembly, the interposer assembly comprising;
• coaxial cables, each of the coaxial cables being configured to transport a first portion of current originating from a current source;
• printed circuit boards (PCBs), each of the PCBs being connected to a set of the coaxial cables in order to receive the first portion of the current from each coaxial cable in the set and to transport a second portion of the current;
• and
• a spring leaf assembly comprising spring leaves, each of the spring leaves being connected to a PCB in order to transport a third portion of the current obtained from the PCB to the DIB;
• wherein the coaxial cables on each PCB are arranged in parallel, the PCBs are arranged in parallel, and the spring leaves on each PCB are arranged in parallel.