Discrete antenna module with via wall structure
AssigneeQUALCOMM Incorporated
InventorsTaesik YANG, Mohammad Ali TASSOUDJI, Jeongil Jay KIM, Darryl Sheldon JESSIE, Kevin Hsi-Huai WANG
Life of this patent
Estimating the term…
Abstract
Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.
Claims30
A wireless device, comprising:
- at least one radio frequency integrated circuit;
- and
- at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, comprising:
- a first patch operably coupled to the at least one radio frequency integrated circuit;
- aground plane disposed below the first patch;
- and
- a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.
A patch antenna, comprising:
- a first patch disposed on a dielectric substrate;
- a ground plane disposed below the first patch, wherein the dielectric substrate is within a gap between the first patch and the ground plane;
- and
- a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane and extend orthogonally from the ground plane towards the first patch.
A patch antenna array, comprising:
- a plurality of patch antennas disposed on a mounting substrate, wherein each patch antenna comprises:
- a first patch disposed on a dielectric substrate;
- a ground plane disposed below the first patch, wherein the dielectric substrate is within a gap between the first patch and the ground plane;
- and
- a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane and extend orthogonally from the ground plane towards the first patch.
A patch antenna, comprising:
- a dielectric substrate having a top surface and a bottom surface;
- a surface patch disposed on the top surface of the dielectric substrate;
- a high frequency patch disposed within the dielectric substrate and below the surface patch, wherein the surface patch is capacitively coupled to the high frequency patch;
- a low frequency patch disposed within the dielectric substrate and between the high frequency patch and the bottom surface of the dielectric substrate;
- a ground plane disposed on the bottom surface of the dielectric substrate;
- and
- a plurality of via wall structures disposed within the dielectric substrate in a perimeter around the high frequency patch and the low frequency patch, wherein each of the plurality of via wall structures are electrically coupled to the ground plane and extend orthogonally from the ground plane towards the top surface of the dielectric substrate.
Dependencies are inferred from the claim text.