Semiconductor device and method for manufacturing same
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshihiro YOSHIDA, Koichi YOSHIDA
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a base, a detector on the base and including a first surface on which a detection portion is provided, and a resin package on the base and including an exposure hole to externally expose the detection portion of the detector. At least a portion of an outer peripheral edge of the first surface of the detector is exposed in the exposure hole. The resin package includes a depressed portion along the portion of the outer peripheral edge that is exposed in the exposure hole.
Claims18
A semiconductor device comprising:
- a base;
- a detector on the base and including a first surface on which a detection portion is provided;
- and
- a resin package on the base and including an exposure hole to externally expose the detection portion of the detector;
- wherein
- at least a portion of an outer peripheral edge of the first surface of the detector is exposed in the exposure hole;
- and
- the resin package includes a depressed portion along the portion of the outer peripheral edge that is exposed in the exposure hole.
A method of manufacturing a semiconductor device in which, on a base on which a detector including a first surface on which a detection portion is located is provided, a resin package that includes an exposure hole to externally expose the detection portion of the detector is provided, the method comprising:
- bringing a mold release film into close contact with a mold that includes a cavity with a projection;
- placing the mold with respect to the base such that the first surface of the detector sinks into a portion of the mold release film that is located on a top surface of the projection;
- filling the cavity of the mold with a melted resin material;
- separating the mold and the mold release film from the resin package that includes a solidified resin material;
- and
- positioning an outer peripheral edge of the top surface of the projection so that, in a view from a direction in which the projection of the mold and the first surface of the detector face each other, the outer peripheral edge is at least partially positioned in an outer side portion of an outer peripheral edge of the first surface.
Dependencies are inferred from the claim text.