Display panel, manufacturing method thereof, and display device

A manufacturing method of a display panel, wherein the display panel comprises a display region comprising a plurality of pixel regions and a non-display region surrounding the display region;

• and
• the manufacturing method comprises steps of:
• step S10:
• forming a first metal layer on a substrate and patterning the first metal layer to form a first electrode layer, wherein the first electrode layer comprises a first electrode corresponding to the non-display region, a gate corresponding to the display region, and a solder pad corresponding to each of the plurality of pixel regions;
• step S20:
• forming a gate insulating layer and an active layer on the first electrode layer, wherein the active layer comprises a channel region, a source contact region, and a drain contact region, and the source contact region and the drain contact region are separated by the channel region;
• step S30:
• patterning the gate insulating layer to form a through hole positioned on the first electrode;
• step S40:
• forming a second metal layer on the active layer and the gate insulating layer and patterning the second metal layer to form a second electrode layer, wherein the second electrode layer comprises a second electrode positioned on the first electrode, a source in contact with the source contact region, and a drain in contact with the drain contact region, and the second electrode is in contact with the first electrode through the through hole;
• step S50:
• forming a passivation layer on the second electrode layer and patterning the passivation layer to form an opening partially exposing the solder pad and an opening partially exposing the second electrode;
• and
• step S60:
• adding a soldering material into the opening corresponding to the solder pad and electrically connecting a solder electrode of a mini/micro light-emitting diode to the solder pad through the soldering material.

A display device, comprising a display panel;

• wherein the display panel comprises:
• a display region comprising a plurality of pixel regions;
• a non-display region surrounding the display region;
• a substrate;
• and
• a solder pad and a signal line disposed on the substrate, wherein the solder pad corresponds to each of the plurality of pixel regions and is electrically connected to the signal line;
• wherein material of the solder pad comprises at least one of a molybdenum/copper stackup, a molybdenum-titanium alloy/copper stackup, or a titanium-molybdenum-nickel alloy/copper stackup;
• and
• wherein a solder electrode of a mini/micro light-emitting diode is electrically connected to the solder pad through a soldering material.