Surface mountable light emitting diode package with inclined light emitting surface

A lighting device, comprising:

• a lens that reflects electromagnetic radiation comprising visible and infrared light;
• and
• a surface mountable package comprising
• a top surface that is parallel to a mounting surface of the surface mountable package to facilitate an attachment, via an automatic surface mount technology pick-and-place equipment, of the mounting surface to a printed circuit board (PCB) of the lighting device,
• a cavity comprising a material that transmits the electromagnetic radiation comprising the visible light and the infrared light,
• at least one optoelectronic device that is positioned within the cavity and that at least one of generates or receives the electromagnetic radiation, and
• a light emitting surface that is adjacent to the top surface and that is inclined at an angle relative to a vertical axis of a plane of the top surface to facilitate, via the lens, at least one of
• a transmission, via the material, of the electromagnetic radiation from the at least one optoelectronic device, or
• a reception, by the at least one optoelectronic device via the material, of the electromagnetic radiation.