US 2022/0190208 A1 · SUPPORT STRUCTURES FOR LIGHT EMITTING DIODE PACKAGES

Abstract

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly support structures for LED packages are disclosed. Support structure arrangements are provided for LED packages with increased reflectivity. Support structures may include patterned electrically conductive materials that provide electrical connections and bonding surfaces for LED chips within the package, and bonding surfaces for cover structures in certain arrangements. Depending on the wavelengths of light emitted by the LED package, light reflectivity tradeoffs can exist for conductive materials that provide suitable electrical connections and bonding surfaces. Additional patterned layers with increased reflectivity may be provided on underlying patterned electrically conductive materials. The patterned layers with increased reflectivity may be arranged in areas of the LED package where light may impinge surfaces of the LED package that are outside of one or more of a die attach area and a cover structure mounting area for the LED package.

Claims31

Dependent claims

A light emitting diode (LED) package comprising:

a submount comprising a first face and a second face that opposes the first face;
at least one LED chip on the first face of the submount;
a cover structure arranged over the at least one LED chip;
a first patterned trace on the first face of the submount, the first patterned trace forming at least one die attach pad for the at least one LED chip and wherein the cover structure is attached to the first patterned trace at a cover structure mounting area that is outside of the at least one die attach pad;
a second patterned trace on the first patterned trace, wherein the second patterned trace is provided on a portion of the first patterned trace that is between the at least one die attach pad and the cover structure mounting area.

2 more elements

Dependencies are inferred from the claim text.

Support structures for light emitting diode packages

Life of this patent

Support structures for light emitting diode packages

Life of this patent

Abstract

Claims31