Method for forming semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Wei LEE, Yen-Ru LEE, Hsueh-Chang SUNG, Yee-Chia YEO
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Wei LEE, Yen-Ru LEE, Hsueh-Chang SUNG, Yee-Chia YEO
Estimating the term…
A method for forming a semiconductor structure includes forming a gate structure over a substrate. The method also includes forming a spacer on a sidewall of the gate structure. The method also includes forming a source/drain recess beside the spacer. The method also includes treating the source/drain recess and partially removing the spacers in a first cleaning process. The method also includes treating the source/drain recess with a plasma process after performing the first cleaning process. The method also includes treating the source/drain recess in a second cleaning process after treating the source/drain recess with the plasma process. The method also includes forming a source/drain structure in the source/drain recess after performing the second cleaning process.
A method for forming a semiconductor structure, comprising:
A method for forming a semiconductor structure, comprising:
A method for forming a semiconductor structure, comprising:
Dependencies are inferred from the claim text.