Alignment-Tolerant Gallium Oxide Device
AssigneeGovernment of the United States as Represented by the Secretary of the Air Force
InventorEric Heller
Life of this patent
Estimating the term…
Abstract
A gallium oxide field effect transistor that is built on a base layer. A doped gallium oxide channel layer is disposed on top of the base layer, and a dielectric barrier layer is disposed on top of the gallium oxide channel layer. Source contacts and drain contacts are disposed on top of the dielectric barrier layer, with one each of the drain contacts disposed in an interdigitated manner between one each of the source contacts. The interdigitated source contacts and drain contacts thereby define channels between them, where alternating ones of the channels are defined as odd channels, with even channels disposed therebetween. Gate contacts are disposed on top of the dielectric barrier layer in only one of the odd channels and the even channels.
Claims13
An electronic circuit including a gallium oxide power field effect transistor (FET), the gallium oxide field effect transistor comprising:
- a base layer;
- a doped gallium oxide channel layer disposed on top of the base layer;
- a dielectric barrier layer disposed on top of the gallium oxide channel layer, wherein a portion of the dielectric layer is altered for providing a source contact or a drain contact;
- the source contacts disposed on top of the altered dielectric barrier layer;
- the drain contacts disposed on top of the altered dielectric barrier layer, with one each of the drain contacts disposed in an interdigitated manner between adjacent ones of the source contacts such that channels are defined as odd channels and with even channels disposed therebetween;
- and
- gate contacts disposed on top of the dielectric barrier layer in of the odd channels or the even channels while the even channels or the odd channels without gate contacts are electrically insulated,
- wherein misalignment of the gate contacts in the odd channels between source contacts and the drain contacts causes odd channels to turn on at a rate and voltage that differs from a turn on rate and voltage resulting from misalignment of the gate contacts in the event channels between drain contacts and source contacts and wherein having removing the gate contacts from the odd channels or the even channels provides uniform turn on rate and voltage.
A method for fabricating a gallium oxide power field effect transistor (FET), the method comprising the steps of:
- forming a base layer;
- forming a doped gallium oxide channel layer disposed on top of the base layer;
- forming a dielectric barrier layer disposed on top of the gallium oxide channel layer;
- altering a portion of the dielectric layer;
- forming source contacts and drain contacts on top of the altered portion of the dielectric barrier layer such that the drain contacts are disposed in an interdigitated manner between adjacent ones of the source contacts such that channels are defined between the interdigitated drain contacts and source contacts, where alternating ones of the channels are defined as odd channels and with even channels disposed therebetween;
- forming gate contacts in only one of the odd channels and the even channels.
Dependencies are inferred from the claim text.