Semiconductor device and manufacturing method of semiconductor device
AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorHIROFUMI KIDA
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AssigneesDenso Corporation, Toyota Jidosha Kabushiki Kaisha, MIRISE Technologies Corporation
InventorHIROFUMI KIDA
Estimating the term…
A compound semiconductor layer in a semiconductor device includes a drift region of a first conductivity type, a JFET region of the first conductivity type disposed above the drift region, a body region of a second conductivity type disposed above the drift region and adjacent to the JFET region, and a JFET embedded region of the second conductivity type or i-type disposed in the JFET region. The JFET region has a bottom surface portion adjacent to the drift region, a side surface portion adjacent to the body region, and an inside portion adjacent to the JFET embedded region, and further has a high concentration portion at the bottom surface portion and the side surface portion. The high concentration portion has an impurity concentration higher than an impurity concentration of the inside portion.
A semiconductor device comprising a compound semiconductor layer that includes:
A manufacturing method of a semiconductor device, comprising:
Dependencies are inferred from the claim text.