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US 2022/0190087 A1Published application
Bonding area circuit
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorsYicheng CHEN, Hong WEN
Life of this patent
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Abstract
A bonding area circuit includes a plurality of wires. An end area of each of the wires is smaller than a front end area of each of the wires. A distance between the front end areas of two adjacent wires is larger than a distance between the end areas of the two adjacent wires. The present invention makes the distance between the end areas becomes longer. In this way, the short circuit issue during the testing or operating processes due to the residue metal scraps could be alleviated.
Claims18
A bonding area circuit, comprising:
- a plurality of wires, an end area of each of the wires is smaller than a front end area of each of the wires;
- wherein a distance between the front end areas of two adjacent wires is larger than a distance between the end areas of the two adjacent wires;
- wherein the wires are manufactured by a lithography and etching process, and the end area is chamfered.
A bonding area circuit, comprising:
- a plurality of wires, an end area of each of the wires is smaller than a front end area of each of the wires, wherein a distance between the front end areas of two adjacent wires is larger than a distance between the end areas of the two adjacent wires.
Dependencies are inferred from the claim text.