Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsKazuya UEJIMA, Kazuhiro KOUDATE
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Abstract
Reduction in power consumption of a semiconductor device is achieved. The semiconductor device includes: a first circuit operating at a first power supply voltage and a second circuit operating at a second power supply voltage and including a level shift unit and a switch unit, the first circuit is configured of a low-breakdown-voltage n-type transistor that is an SOTB transistor, and the switch unit is configured of an n-type transistor that is an SOTB transistor. A second power supply voltage is higher than a first power supply voltage, and an impurity concentration of a channel formation region of the n-type transistor is higher than an impurity concentration of a channel formation region of the low-breakdown-voltage n-type transistor.
Claims5
A semiconductor device comprising:
- a first circuit connected between a first power supply line and a ground line;
- a second circuit connected between a second power supply line and the ground line;
- a third circuit connected between the second power supply line and the ground line,
- wherein the second circuit receives an input signal from the first circuit, converts the input signal, and outputs the converted input signal to the third circuit,
- wherein the second circuit includes a logic circuit and a switch element,
- wherein the logic circuit and the switch element are connected between the second logic circuit and a second ground line, wherein the logic circuit comprises a first transistor of a first conductive type;
- and
- wherein the switch element comprises a second transistor of the first conductive type,
- wherein the first transistor includes:
- a support substrate;
- a first semiconductor layer arranged on the support substrate via a first insulating layer;
- a first source region of the first conductive type, a first drain region of the first conductive type, and a first channel formation region formed within the first semiconductor layer;
- and a first gate electrode arranged on the first channel formation region through a first gate insulating film,
- the second transistor includes:
- the support substrate;
- a second semiconductor layer arranged on the support substrate via a second insulating layer;
- a second source region of the first conductive type, a second drain region of the first conductive type, and a second channel formation region formed within the second semiconductor layer;
- and
- a second gate electrode arranged on the second channel formation region via a second gate insulating film, and
- wherein an impurity concentration of the second channel formation region is higher than an impurity concentration of the first channel formation region.
Dependencies are inferred from the claim text.