Semiconductor structure and the forming method thereof
AssigneeWinbond Electronics Corp.
InventorsChih-Jung NI, Chuan-Chi CHOU, Yao-Ting TSAI
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AssigneeWinbond Electronics Corp.
InventorsChih-Jung NI, Chuan-Chi CHOU, Yao-Ting TSAI
Estimating the term…
A semiconductor structure is provided. The semiconductor structure includes a substrate, a gate structure, and a first spacer. The gate structure includes a floating gate structure disposed on the substrate, an inter-gate dielectric layer disposed on the floating gate structure, and a control gate structure disposed on the inter-gate dielectric layer. The control gate structure includes an electrode layer disposed on the inter-gate dielectric layer, a contact layer disposed on the electrode layer, and a cap layer disposed on the contact layer. The first spacer is disposed on a sidewall of the control gate structure and covering the electrode, the contact layer and the cap layer. A bottom surface of the first spacer is positioned between a bottom surface and a top surface of the electrode layer.
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.