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US 2022/0189929 A1Published application
Power module package
AssigneePower Master Semiconductor Co., Ltd.
InventorsIn-Suk KIM, Ki-Myung YOON
Life of this patent
Estimating the term…
Abstract
A power module package is provided. The power module package may include: a first substrate; a second substrate; a semiconductor chip disposed between the first substrate and the second substrate; and a mutual-connection layer that is formed between the semiconductor chip and the second substrate and provides conductive connection between the semiconductor chip and the second substrate.
Claims20
A power module package comprising:
- a first substrate;
- a second substrate;
- a semiconductor chip disposed between the first substrate and the second substrate;
- and
- a mutual-connection layer that is formed between the semiconductor chip and the second substrate and provides conductive connection between the semiconductor chip and the second substrate.
2 more elements
A power module package comprising:
- a semiconductor chip;
- a first external metal layer, a first internal metal layer, and a first ceramic layer that is formed between the first external metal layer and the first internal metal layer;
- and
- a second external metal layer, a second internal metal layer, and a second ceramic layer formed between the second external metal layer and the second internal metal layer,
- wherein a first side of the semiconductor chip contacts the first internal metal layer, and
- a second side of the semiconductor chip contacts the second internal metal layer through a mutual-connection layer.
3 more elements
A power module package comprising:
- a first semiconductor chip and a second semiconductor chip;
- a first substrate that is formed above the first semiconductor chip and the second semiconductor chip;
- a second substrate that is formed above the first semiconductor chip and the second semiconductor chip;
- a first mutual-connection layer that is formed between the first semiconductor chip and the first substrate, and provides conductive connection between the first semiconductor chip and the first substrate;
- and
- a second mutual-connection layer that is formed between the second semiconductor chip and the second substrate, and provides conductive connection between the second semiconductor chip and the second substrate.
3 more elements
Dependencies are inferred from the claim text.