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US 2022/0189927 A1Published application
Dual-die semiconductor package
AssigneeNanya Technology Corporation
InventorsWU-DER YANG, CHUN-HUANG YU
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Abstract
The present application provides a semiconductor package and a manufacturing method thereof. The semiconductor package includes a package substrate, a bottom device die, an interposing package substrate and a top device die. The bottom device die is bonded to the package substrate. The interposing package substrate is located over the bottom device die and bonded to the package substrate. The top device die is bonded to the interposing package substrate form above the interposing package substrate.
Claims12
A semiconductor package, comprising:
- a package substrate;
- a bottom device die, bonded to the package substrate;
- an interposing package substrate, located over the bottom device die and bonded to the package substrate;
- and
- a top device die, bonded to the interposing package substrate from above the interposing package substrate.
2 more elements
Dependencies are inferred from the claim text.