Chip package structure and method of manufacturing the same
AssigneeUnimicron Technology Corp.
InventorsTzu-Hsuan WANG, Chen-Hsien LIU
Life of this patent
Estimating the term…
Abstract
A chip package structure includes a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermally conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermally conductive material.
Claims19
A chip package structure, comprising:
- a wiring board, comprising a main part and a plurality of circuit pads, wherein the main part has a mounting surface, and the circuit pads are located on the mounting surface;
- a first chip, mounted on the mounting surface and electrically connected to at least one of the circuit pads;
- a second chip, stacked on the first chip, wherein the first chip is located between the second chip and the wiring board, and the second chip has a first surface and a second surface opposite to the first surface;
- a thermally conductive material, located on the wiring board and passing through both the second chip and the first chip, wherein the thermally conductive material passing through the second chip and the first chip in sequence from the second surface of the second chip extends to the wiring board;
- a molding compound, disposed on the mounting surface and covering the first chip and the mounting surface, wherein the molding compound surrounds the second chip;
- and
- a heat dissipation part, disposed on the molding compound and thermal coupled to the thermally conductive material, wherein the molding compound is located between the heat dissipation part and the wiring board.
A method of manufacturing chip package structure, comprising:
- mounting a first chip and a second chip on a wiring board, wherein the first chip is located between the second chip and the wiring board, the first chip has at least one first through hole, and the second chip has at least one second through hole;
- filling both the at least one first through hole and the at least one second through hole with a thermally conductive material;
- forming a molding compound on the wiring board, wherein the molding compound covers the first chip and the wiring board, and surrounds the second chip;
- and
- forming a heat dissipation part on the molding compound, wherein the heat dissipation part is thermally couple to the thermally conductive material.
Dependencies are inferred from the claim text.