Package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
Life of this patent
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Abstract
A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.
Claims3
A package structure, comprising:
- a first die and a second die;
- a dielectric layer, disposed on the first die and the second die;
- a bridge, electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge;
- an encapsulant, disposed on the dielectric layer and laterally encapsulating the bridge;
- and
- a redistribution layer structure, disposed over the encapsulant and the bridge, wherein a top surface of the bridge is in contact with the RDL structure.
A package structure, comprising:
- a first die and a second die;
- a bridge, electrically connected to the first die and the second die and having a bottom surface facing the first die and the second die;
- an encapsulant encapsulating sidewalls of the bridge, wherein a top surface of the encapsulant is level with a top surface of the bridge;
- and
- a dielectric layer, disposed between the encapsulant and at least one of the first die and the second die, wherein the dielectric layer is separated from the bridge.
A package structure, comprising:
- a first die and a second die arranged side by side;
- a bridge, disposed over and electrically connected to the first die and the second die;
- an encapsulant, laterally encapsulating the bridge;
- and
- a dielectric layer, sandwiched between the encapsulant and the first die, and between the encapsulant and the second die;
- wherein the bridge is disposed within a bridge joint area exposed by the dielectric layer, and a width of the bridge joint area is larger than a width of the bridge.
Dependencies are inferred from the claim text.