Semiconductor packages including passive devices and methods of forming same

A method comprising:

• attaching a first passive package to a carrier substrate, the first passive package comprising a stack of passive dies, each of the passive dies comprising a plurality of passive devices on a substrate and a through via extending through the substrate;
• attaching a first integrated circuit package to the carrier substrate, the first integrated circuit package comprising at least one integrated circuit die, the at least one integrated circuit die comprising a plurality of active devices;
• encapsulating the first passive package and the first integrated circuit package with an encapsulant;
• and
• forming a first redistribution structure on the first encapsulant, the first integrated circuit package, and the first passive package, the first redistribution structure comprising a plurality of dielectric layers with metallization patterns therein, the metallization patterns of the first redistribution structure being electrically coupled to the first integrated circuit package and the first passive package.

A structure comprising:

• a first semiconductor device comprising:
• a first plurality of passive devices formed on a first substrate;
• and
• a first through via extending through the first substrate, the first through via being electrically coupled to the first plurality of passive devices;
• a second semiconductor device comprising:
• a second plurality of passive devices formed on a second substrate;
• and
• a second through via extending through the second substrate, the second through via being electrically coupled to the second plurality of passive devices;
• a first set of conductive connectors electrically bonding the first semiconductor device and the second semiconductor device, at least one of the first set of conductive connectors electrically coupling the first through via and the second through via;
• and
• a second set of conductive connectors electrically coupled to the first semiconductor device, the second set of conductive connectors being on an opposite side of the first semiconductor device as the first set of conductive connectors.