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US 2022/0189918 A1Published application
Package structure and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
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Abstract
A structure including stacked substrates, a first semiconductor die, a second semiconductor die, and an insulating encapsulation is provided. The first semiconductor die is disposed over the stacked substrates. The second semiconductor die is stacked over the first semiconductor die. The insulating encapsulation includes a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.
Claims20
A structure, comprising:
- stacked substrates;
- a first semiconductor die laterally encapsulated by a first encapsulation portion;
- a first bonding structure covering the first semiconductor die and the first encapsulation portion;
- and
- a second semiconductor die comprising a second bonding structure electrically connected to the first bonding structure, the second semiconductor die and the second bonding structure being laterally encapsulated by a second encapsulation portion, the first bonding structure and the first semiconductor die being between the second semiconductor die and the stacked substrates, wherein the first encapsulation portion is spaced apart from the second encapsulation portion by the first bonding structure.
2 more elements
A structure, comprising:
- a support substrate;
- a first semiconductor die;
- a second semiconductor die, wherein the first semiconductor die is disposed between the second semiconductor die and the support substrate;
- an alignment mark disposed on the first semiconductor die, wherein the alignment mark is between the first semiconductor die and the support substrate;
- and
- a first insulating encapsulation comprising a first encapsulation portion encapsulating the first semiconductor die and a second encapsulation portion encapsulating the second semiconductor die.
3 more elements
A method, comprising:
- forming a first encapsulation portion to laterally encapsulating first semiconductor dies spaced apart from each other;
- bonding a support substrate to back surfaces of the first semiconductor dies and the first encapsulation portion;
- forming a first bonding structure on front surfaces of the first semiconductor dies and the first encapsulation portion;
- bonding second bonding structures of second semiconductor dies to the first bonding structure such that the second bonding structures are electrically connected to the first bonding structure;
- forming a second encapsulation portion over the first bonding structure to laterally encapsulate the second semiconductor dies;
- and
- after forming the first encapsulation portion to laterally encapsulating the first semiconductor dies, bonding a support substrate comprising stacked substrates to back surfaces of the first semiconductor dies and the first encapsulation portion.
4 more elements
Dependencies are inferred from the claim text.