Automated-position-aligning method for transferring chip and system using the method
AssigneeYu-Jung WU
InventorsYu-Jung WU, Hsu-Nan FANG
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AssigneeYu-Jung WU
InventorsYu-Jung WU, Hsu-Nan FANG
Estimating the term…
An automated-position-aligning method for transferring chips includes forming a chip-carrier base, applying a liquid, disposing a chip, transporting a carrier substrate and transferring the chip. A related system includes a carrier substrate, a liquid applying device, a chip disposing device, a carrier substrate transporting device and a chip transferring device. A carrier surface of the carrier substrate is crisscrossed by spacing grooves to form chip-carrier bases thereon. The carrier surface is hydrophilic, and the spacing grooves are hydrophobic. The liquid gathers on the chip-carrier bases. A plurality of chips are positioned and attached on the respective chip-carrier bases by surface free energy of the liquid. An electromagnetic wave radiates to the carrier substrate to heat and evaporate the liquid between each chip-carrier base and each chip such that the chips are released from the chip-carrier bases and fall to a receiving surface of a receiving substrate.
An automated-position-aligning method for transferring chip, comprising:
A system using an automated-position-aligning method for transferring chip, comprising:
Dependencies are inferred from the claim text.