Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsSoohyun NAM, Younglyong KIM
Life of this patent
Estimating the term…
Abstract
A semiconductor package including an interposer substrate, first to third semiconductor chips on the interposer substrate to face each other, an underfill part between each of the first to third semiconductor chips and the interposer substrate, a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips, and a second side-fill part between the side walls of the first to third semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the first to third semiconductor chips may be provided.
Claims20
A semiconductor package comprising:
- an interposer substrate;
- first to third semiconductor chips on the interposer substrate to face each other;
- an underfill part between each of the first to third semiconductor chips and the interposer substrate;
- a first side-fill part extending upward from a lower end of side walls of the first to third semiconductor chips;
- and
- a second side-fill part between the side walls of the first to third semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the first to third semiconductor chips,
- wherein an upper surface of the first semiconductor chip comprises a first edge facing the second semiconductor chip, a second edge facing the third semiconductor chip, and a first corner at which the first edge meets the second edge,
- an upper surface of the second semiconductor chip comprises a third edge facing the first semiconductor chip, a fourth edge facing the third semiconductor chip, and a second corner at which the third edge meets the fourth edge, and
- the second side-fill part extends from the first corner of the first semiconductor chip along each of the first edge and the second edge of the first semiconductor chip and extends from the second corner of the second semiconductor chip along each of the third edge and the fourth edge of the second semiconductor chip.
A semiconductor package comprising:
- a base;
- at least three semiconductor chips on the base to face each other, the at least three semiconductor chips electrically connected to the base;
- an underfill part between the at least three semiconductor chips and the base;
- a first side-fill part extending upward from a lower end of side walls of the at least three semiconductor chips;
- and
- a second side-fill part between the side walls of the at least three semiconductor chips and extending from the first side-fill part to an upper end of the side walls of the at least three semiconductor chips,
- wherein the second side-fill part is in contact with each of the at least three semiconductor chips.
A semiconductor package comprising:
- an interposer substrate;
- a plurality of semiconductor chips on the interposer substrate, each of the plurality of semiconductor chips comprising a lower surface facing the interposer substrate and an upper surface that is opposite to the lower surface;
- a first side-fill part filling between side walls of the plurality of semiconductor chips and extending upward from a lower end of the side walls of the plurality of semiconductor chips;
- and
- a second side-fill part between the side walls of the plurality of semiconductor chips and extending downward from an upper end of the side walls of the plurality of semiconductor chips,
- wherein the second side-fill part is in contact with a portion of at least one of edges of an upper surface of each of the plurality of semiconductor chips, and
- the first side-fill part is in contact with the other portion of the at least one of the edges of the upper surface of each of the plurality of semiconductor chips.
Dependencies are inferred from the claim text.