Semiconductor package including stacked semiconductor chips

A method for fabricating a semiconductor package, comprising:

• forming a base layer,
• forming first to Nth semiconductor chips over the base layer, N being a natural number of 2 or more, the first to Nth semiconductor chips being sequentially offset stacked so that a chip pad portion of one side edge region is exposed, wherein the chip pad portion includes a chip pad and includes a redistribution pad that partially contacts the chip pad and extends away from the chip pad;
• and
• forming a bonding wire that connects the chip pad of a kth semiconductor chip among the first to Nth semiconductor chips to the is redistribution pad of a k−1th semiconductor chip or a k+1th semiconductor chip when k is a natural number greater than 1 and connects the chip pad of the kth semiconductor chip to a pad of the base layer or the redistribution pad of the k+1th semiconductor chip when k is 1.