Non-conductive film sheet and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJoungphil Lee, Yeongseok Kim
Life of this patent
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Abstract
Provided is a semiconductor package including: at least one semiconductor device on a first substrate; a non-conductive film (NCF) on the at least one semiconductor device and comprising an irreversible thermochromic pigment; and a molding member on the at least one semiconductor device in a lateral direction, wherein a content of the irreversible thermochromic pigment in the NCF is about 0.1 wt % to about 5 wt % with respect to a weight of the NCF.
Claims26
A non-conductive film (NCF) sheet comprising:
- an NCF comprising an irreversible thermochromic pigment, the NCF comprising first and second opposing surfaces;
- a first cover film on the first surface of the NCF;
- and
- a second cover film on the second surface of the NCF.
(canceled)
A semiconductor package comprising:
- at least one semiconductor device on a first substrate;
- a non-conductive film (NCF) on the at least one semiconductor device and comprising an irreversible thermochromic pigment;
- and
- a molding member on the at least one semiconductor device in a lateral direction,
- wherein a content of the irreversible thermochromic pigment in the NCF is about 0.1 wt % to about 5 wt % with respect to a weight of the NCF.
13-14. (canceled)
(canceled)
A semiconductor package comprising:
- a package substrate;
- an interposer substrate on the package substrate;
- a first semiconductor device on the interposer substrate and comprising stacked semiconductor chips;
- and
- a second semiconductor device adjacent to the first semiconductor device and on the interposer substrate,
- wherein the first semiconductor device comprises a non-conductive film (NCF) comprising an irreversible thermochromic pigment.
(canceled)
(canceled)
27-31. (canceled)
Dependencies are inferred from the claim text.