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US 2022/0189900 A1Published application
Electronic package and fabrication method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChia-Yu Kuo, Rui-Feng Tai, Yih-Jenn Jiang, Don-Son Jiang, Chang-Fu Lin
Life of this patent
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Abstract
An electronic package is provided and includes at least one conductor with a relatively large width formed on an electrode pad of an electronic element and in contact with a circuit layer. As such, when the electronic element and the circuit layer deviate in position relative to one another, the circuit layer will be still in contact with the conductor and hence electrically connected to the electronic element.
Claims20
An electronic package, comprising:
- an encapsulant;
- an electronic element embedded in the encapsulant and having a plurality of electrode pads;
- at least a conductor formed on and electrically connected to at least one of the electrode pads, wherein the conductor has a metal structure;
- and
- a circuit layer formed on the encapsulant and in contact with the conductor.
2 more elements
A method for fabricating an electronic package, comprising:
- providing at least one electronic element having a plurality of electrode pads;
- encapsulating the electronic element with an encapsulant and forming at least one conductor on at least one of the electrode pads, wherein the conductor has a metal structure and is electrically connected to the electrode pad;
- and
- forming a circuit layer on the encapsulant, wherein the circuit layer is in contact with the conductor.
1 more element
Dependencies are inferred from the claim text.