High-speed die connections using a conductive insert
AssigneeAdvanced Micro Devices, Inc.
InventorRAHUL AGARWAL
Life of this patent
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Abstract
A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.
Claims20
A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising:
- a die;
- a plurality of redistribution layers;
- a conductive insert housed in a perforation through the plurality of redistribution layers;
- and
- a conductive bump conductively coupled to an input/output connection point of the die via the conductive insert.
A method for high-speed die connections using a conductive insert, comprising:
- creating a perforation in a plurality of redistribution layers of a semiconductor package, wherein the perforation exposes an input/output connection point of a die;
- inserting, into the perforation, a conductive insert;
- and
- applying a conductive bump to the semiconductor package creating a conductive pathway between the conductive bump and the input/output connection point of the die.
An apparatus for high-speed die connections using a conductive insert, the apparatus comprising:
- a component;
- and
- a semiconductor package operatively coupled to the component, the semiconductor package comprising:
- a die;
- a plurality of redistribution layers;
- a conductive insert housed in a perforation through the plurality of redistribution layers;
- and
- a conductive bump conductively coupled to an input/output connection point of the die via the conductive insert.
Dependencies are inferred from the claim text.