Radio-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorsShunji YOSHIMI, Mitsunori SAMATA
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AssigneeMurata Manufacturing Co., Ltd.
InventorsShunji YOSHIMI, Mitsunori SAMATA
Estimating the term…
A semiconductor device including a radio-frequency amplifier circuit and a band selection switch is mounted on or in a module substrate. An output matching circuit coupled between the radio-frequency amplifier circuit and the band selection switch is on or in the module substrate. The semiconductor device includes a first member at which the band selection switch having a semiconductor element made of an elemental semiconductor is formed and a second member joined to the first member in surface contact therewith. The radio-frequency amplifier circuit including a semiconductor element made of a compound semiconductor is formed at the second member. Conductive protrusions are raised from first and second members. The semiconductor device is mounted on or in the module substrate with the conductive protrusions interposed therebetween, and in plan view, is in close proximity to the output matching circuit or overlaps a passive element constituting the output matching circuit.
A radio-frequency module comprising:
Dependencies are inferred from the claim text.