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US 2022/0189892 A1Published application
High frequency devices including attenuating dielectric materials
AssigneeInfineon Technologies AG
InventorsPietro BRENNER, Walter HARTNER, Julian Winfried KAISER, Saqib KALEEM
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Abstract
A device includes a high frequency chip and a dielectric material arranged between a first area radiating an electromagnetic interference signal in a first frequency range between 1 GHz and 1 THz and a second area receiving the electromagnetic interference signal. An attenuation of the dielectric material is more than 5 dB/cm at least in a subrange of the first frequency range.
Claims27
A device, comprising:
- a high frequency chip;
- and
- a dielectric material arranged between a first area radiating an electromagnetic interference signal in a first frequency range between 1 GHz and 1 THz and a second area receiving the electromagnetic interference signal,
- wherein an attenuation of the dielectric material is more than 5 dB/cm at least in a subrange of the first frequency range.
1 more element
A device, comprising:
- a high frequency chip;
- and
- an encapsulation material, wherein the high frequency chip is at least partly encapsulated in the encapsulation material,
- wherein the encapsulation material is arranged between a first area radiating an electromagnetic interference signal in a first frequency range between 1 GHz and 1 THz and a second area receiving the electromagnetic interference signal,
- wherein an attenuation of the encapsulation material is more than 5 dB/cm at least in a subrange of the first frequency range.
2 more elements
A device, comprising:
- a high frequency chip;
- an encapsulation material, wherein the high frequency chip is at least partly encapsulated in the encapsulation material,
- wherein the encapsulation material is arranged between a first area radiating an electromagnetic interference signal in a first frequency range between 1 GHz and 1 THz and a second area receiving the electromagnetic interference signal,
- wherein a surface roughness of a peripheral surface of the encapsulation material provides an attenuation of the electromagnetic interference signal between the first and second area of more than 5 dB/cm.
1 more element
Dependencies are inferred from the claim text.