Wireless module
AssigneeFujikura Ltd.
InventorKohei Matsumaru
Life of this patent
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Abstract
The present invention reduces an electromagnetic coupling that can occur between a first signal line provided on a first substrate and a second signal line provided on a main surface of a second substrate on the first substrate side. A wireless module (10) includes an RFIC (28), a baseband IC (16), a first substrate (11) on which first signal lines (121 through 126) for transmitting a baseband signal are provided, and a second substrate (21) provided with second signal lines (2201 through 2232) for transmitting an RF signal on a main surface (211). The first substrate (11) is provided with a pseudo conductor wall (post wall 13) for shielding the first signal lines (121 through 126) and the second signal lines (2201 through 2232).
Claims5
A wireless module, comprising:
- an RFIC which processes an RF signal;
- a baseband IC which processes a baseband signal;
- a first substrate which is provided with the baseband IC on at least one main surface, the first substrate being provided with one or more first signal lines for transmitting the baseband signal;
- a second substrate which is mounted on one main surface side of the first substrate, the RFIC being mounted on a main surface of the second substrate on a first substrate side, and one or more second signal lines for transmitting the RF signal being provided on the main surface on the first substrate side;
- and
- one or more antenna elements which are provided on the second substrate and are supplied with electric power through the one or more second signal lines, wherein
- the first substrate is provided with at least one of a conductor wall and a pseudo conductor wall for shielding the one or more first signal lines and the one or more second signal lines.
Dependencies are inferred from the claim text.