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US 2022/0189890 A1Published application
Semiconductor device having integrated antenna and method therefor
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Vivek Gupta, Richard Te Gan, Kabir Mirpuri
Life of this patent
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Abstract
A semiconductor device having an integrated antenna is provided. The semiconductor device includes a base die having an integrated circuit formed at an active surface and a cap die bonded to the backside surface of the base die. A metal trace is formed over a top surface of the cap die. A cavity is formed under the metal trace. A conductive via is formed through the base die and the cap die interconnecting the metal trace and a conductive trace of the integrated circuit.
Claims20
A semiconductor device comprising:
- a base die having an active surface and a backside surface, an integrated circuit formed at the active surface;
- a cap die having a top surface and a bottom surface, the bottom surface of the cap die bonded to the backside surface of the base die;
- a metal trace formed over the top surface of the cap die;
- a conductive via formed through the base die and the cap die, the conductive via interconnecting the metal trace and a conductive trace of the integrated circuit;
- and
- a cavity formed under the metal trace, a portion of the cap die remaining between the metal trace and the cavity.
3 more elements
A method comprising:
- forming a cavity in a cap die;
- forming a metal trace over a top surface of the cap die and the cavity, a portion of the cap die located between the metal trace and the cavity;
- bonding a bottom surface of the cap die with a backside surface of a base die, the base die including an integrated circuit formed at an active surface;
- and
- interconnecting the metal trace and a conductive trace of the integrated circuit by way of a through via formed through the cap die and the base die.
2 more elements
A semiconductor device comprising:
- a base die having an active surface and a backside surface, an integrated circuit formed at the active surface;
- a cap die having a top surface and a bottom surface, the bottom surface of the cap die bonded to the backside surface of the base die;
- an antenna formed over the top surface of the cap die;
- a conductive via formed through the base die and the cap die, the conductive via interconnecting the antenna and a conductive trace of the integrated circuit;
- and
- a cavity formed under the antenna, a portion of the cap die remaining between the metal trace and the cavity.
3 more elements
Dependencies are inferred from the claim text.