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US 2022/0189889 A9Published application
Embedded thin-film magnetic inductor design for integrated voltage regulator (ivr) applications
AssigneeHuawei Technologies Co., Ltd.
InventorsTae Hong Kim, Jiangqi He, Guotao Wang
Life of this patent
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Abstract
A package including a package substrate; an interposer electrically coupled to the package substrate and including a metal layer; a die including an integrated voltage regulator and electrically coupled to the interposer by solder features; and an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator.
Claims20
A package, comprising:
- a package substrate;
- an interposer electrically coupled to the package substrate and including a metal layer;
- a die including an integrated voltage regulator and electrically coupled to the interposer by solder features;
- and
- an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, wherein the inductor is electrically coupled to the integrated voltage regulator.
2 more elements
A package, comprising:
- a package substrate including a metal layer;
- an interposer including an integrated voltage regulator and electrically coupled to the package substrate by solder features;
- a die electrically coupled to the interposer;
- and
- an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the package substrate, wherein the inductor is electrically coupled to the integrated voltage regulator.
2 more elements
A package, comprising:
- a printed circuit board including a metal layer;
- a package substrate electrically coupled to the printed circuit board by solder features;
- an interposer electrically coupled to the package substrate;
- a die electrically coupled to the interposer, wherein one of the die, the interposer, and the package having an integrated voltage regulator embedded therein;
- and
- an inductor formed by magnetic means disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the printed circuit board, wherein the inductor is electrically coupled to the integrated voltage regulator.
3 more elements
Dependencies are inferred from the claim text.