US 2022/0189880 A1 · MICROELECTRONIC STRUCTURES INCLUDING GLASS CORES

Abstract

Disclosed herein are microelectronic structures including glass cores, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a glass core having through-glass vias (TGVs) therein; a metallization region at a first face of the glass core, wherein a conductive pathway in the first metallization region is conductively coupled to at least one of the TGVs; a bridge component in the metallization region; a first conductive contact at a face of the metallization region, wherein the first conductive contact is conductively coupled to the conductive pathway; and a second conductive contact at the face of the metallization region, wherein the second conductive contact is conductively coupled to the bridge component.

Claims20

Dependent claims

A microelectronic structure, comprising:

a glass core having through-glass vias (TGVs) therein;
a first metallization region at a first face of the glass core, wherein a first conductive pathway in the first metallization region is conductively coupled to at least one of the TGVs;
a second metallization region at a second face of the glass core, wherein a second conductive pathway in the second metallization region is conductively coupled to at least one of the TGVs, and the second face of the glass core is opposite the first face of the glass core;
a bridge component in the first metallization region;
a first conductive contact at a face of the first metallization region, wherein the first conductive contact is conductively coupled to the first conductive pathway;
and
a second conductive contact at the face of the first metallization region, wherein the second conductive contact is conductively coupled to the bridge component.

4 more elements

Dependencies are inferred from the claim text.

Microelectronic structures including glass cores

Life of this patent

Microelectronic structures including glass cores

Life of this patent

Abstract

Claims20