Thermally and electrically conductive interconnects

An integrated circuit structure comprising:

• an insulator layer;
• a first layer and a second layer on opposite sides of the insulator layer;
• and
• an interconnect structure extending through the insulator layer between the first layer and the second layer,
• wherein the interconnect structure is in an opening extending through the insulator layer between the first layer and the second layer and comprises:
• an electrical conductor in the opening extending between the first layer and the second layer;
• and
• a thermally conductive electrical insulator liner along sidewalls of the opening extending between the first layer and the second layer,
• wherein the electrical conductor is positioned to conduct electrical signals between the first layer and the second layer, and
• wherein the thermally conductive electrical insulator liner is positioned to transfer heat between the first layer and the second layer.

A method of forming an interconnect structure comprising:

• forming an opening in an insulator of an integrated circuit structure;
• forming a thermally conductive electrical insulator liner along sidewalls of the opening;
• and
• forming an electrical conductor on the thermally conductive electrical insulator liner in the opening.