Resonant inductive-capacitive isolated data channel

An electronic device, comprising:

• a package structure;
• a first die having:
• a substrate;
• a first metallization level having a first dielectric layer, and a first metal layer, the first dielectric layer on a side of the substrate, the first metal layer on the first dielectric layer;
• a second metallization level having a second dielectric layer, and a second metal layer, the second dielectric layer on the first dielectric layer and the first metal layer, the second metal layer on the second dielectric layer;
• a first plate in the first metal layer;
• a second plate in the second metal layer, the second plate spaced apart from the first plate to form a capacitor;
• and
• a winding in one of the first and second metal layers, the winding coupled to one of the first and second plates in a resonant circuit;
• the first die enclosed in the package structure;
• a second die coupled to the resonant circuit, the second die enclosed in the package structure;
• a third die coupled to the resonant circuit, the third die enclosed in the package structure;
• and
• a first lead coupled to the resonant circuit, a portion of the first lead extending out of the package structure;
• and
• a second lead coupled to the resonant circuit, a portion of the second lead extending out of the package structure.

A method of manufacturing a packaged electronic device, the method comprising:

• forming a first dielectric layer on a side of a substrate;
• forming a first metal layer on the first dielectric layer, the first metal layer having a first plate;
• forming a second dielectric layer on the first dielectric layer and on the first metal layer;
• forming a second metal layer on the second dielectric layer, the second metal layer having:
• a second plate spaced apart from the first plate, and a winding coupled to the second plate in a resonant circuit;
• and
• forming a protective overcoat layer on the second dielectric layer and on the second metal layer, the protective overcoat layer having an opening that exposes a portion of the second plate.

An electronic device, comprising:

• a substrate;
• a single metallization level having a dielectric layer and a metal layer, the dielectric layer on a side of the substrate, the metal layer on the first dielectric layer;
• a primary winding in the metal layer, the primary winding coupled to first and second plates in the metal layer;
• and
• a secondary winding in the metal layer, the secondary winding coupled to third and fourth plates in the metal layer.