Fine pitch copper pillar package and method

An electronic component assembly comprising:

• an electronic component comprising a pad, the pad comprising a longitudinal pad length and a latitudinal pad width;
• and
• a conductive pillar coupled to the pad, the conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width,
• wherein:
• the latitudinal pillar width is less than the longitudinal pillar length;
• the latitudinal pad width is different from the latitudinal pillar width;
• the longitudinal pad length is different from the longitudinal pillar length;
• and
• a majority of a lateral side of the conductive pillar is free of solder.

An electronic component assembly comprising:

• an electronic component comprising a pad, the pad comprising a first pad side facing away from the electronic component, the first pad side comprising an exposed area having a longitudinal pad length and a latitudinal pad width;
• and
• a conductive pillar coupled to the pad, the conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width,
• wherein:
• the latitudinal pillar width is less than the longitudinal pillar length;
• the latitudinal pad width is different from the latitudinal pillar width;
• the longitudinal pad length is different from the longitudinal pillar length;
• and
• a majority of a lateral side of the conductive pillar is free of solder.

An electronic component assembly comprising:

• an electronic component comprising:
• a first conductor on a first side of the electronic component;
• a non-conductive material surrounding the first conductor such that a first surface area of the first conductor is exposed from the non-conductive material, where the first surface area comprises a first longitudinal length and a first latitudinal width;
• and
• a conductive pillar coupled to the first surface area, the conductive pillar comprising a longitudinal pillar length and a latitudinal pillar width,
• wherein:
• the latitudinal pillar width is less than the longitudinal pillar length;
• the first latitudinal width is different from the latitudinal pillar width;
• the first longitudinal length is different from the longitudinal pillar length;
• and
• a majority of a lateral side of the conductive pillar is free of solder.