Printed circuit board and electronic component package

A printed circuit board comprising:

• an insulating layer;
• a first external connection pad embedded in the insulating layer and exposed;
• and
• a second external connection pad disposed at a pitch distance from the first external connection pad and embedded in the insulating layer and exposed,
• wherein at least one of the first external connection pad or the second external connection pad includes:
• a base pad portion having a first pattern portion in contact with a side surface of the insulating layer and having a first width, and a second pattern portion protruding from the first pattern portion and having a second width smaller than the first width, the second pattern portion having a gap with the side surface of the insulating layer and being embedded in the insulating layer,
• a first metal layer disposed on a side surface and an upper surface of the second pattern portion, and
• a second metal layer disposed on the first metal layer.

An electronic component package comprising:

• a printed circuit board including an insulating layer, a base pad portion embedded in the insulating layer and having a stepped cross-sectional shape having different widths, and a surface treatment layer disposed in a gap between the base pad portion and the insulating layer and extending on an upper surface of the base pad portion;
• a semiconductor chip connected to the surface treatment layer;
• and
• an encapsulation layer encapsulating the semiconductor chip.